The iPhone 18 Pro Chip Dispenses with LPDDR6 Memory, but Apple Has an Alternative Plan

The new iPhone 18 Pro/Pro Max and the foldable Ultra will debut next September and will share the presence of the A20 Pro chip, manufactured at 2 nm. A new leak confirms several elements of this chip, which is destined to carve out a significant space in the market.

The Innovations of the A20 Pro

Unlike the Snapdragon 8 Elite Gen 6 Pro, Apple's new chip will not support LPDDR6 memory, which will likely be a feature of the next generation of chips from the Cupertino company. To ensure a leap in quality in terms of performance (especially regarding artificial intelligence), Apple will introduce two fundamental structural changes to the memory.

The first change is moving to 6 channels and a 96-bit bus, replacing the standard 4-channel configuration with a 64-bit bus used so far, aiming to avoid bottlenecks and allow the Neural Engine to process AI-related data much faster.

Also noteworthy is a new type of packaging, with Apple abandoning the old InFO-PoP packaging in favor of WMCM (Wafer-Level Multi-Chip Module). This system will keep the memory modules (DRAM) physically separated from the main A20 Pro chip, greatly improving heat dissipation and ensuring high and consistent performance over time.

For the debut of the first models with A20 Pro, we just need to wait until next September, when the new iPhone 18 Pro and Pro Max will be presented, along with the first foldable from the Cupertino company, the iPhone Ultra.