Ryzen PRO 9000, AMD introduces 3D V-Cache and TDP up to 170W in the business line

AMD has expanded its offering of professional processors by announcing six new models from the Ryzen PRO 9000 family based on Zen 5 architecture. The main novelty is the introduction of 3D V-Cache technology in the PRO line, intended for workstations and managed business systems—a change that marks a clear evolution compared to previous generations mainly focused on energy efficiency.

The new top model is the Ryzen 9 PRO 9965X3D, a processor equipped with 16 Zen 5 cores and 32 threads, capable of reaching boost frequencies up to 5.5 GHz. The CPU integrates a total of 128 MB of L3 cache due to the use of 3D V-Cache on one of the two 8-core CCDs. The TDP reaches 170W, an unprecedented value for the Ryzen PRO family, historically limited to 65W configurations.

AMD also offers the Ryzen 9 PRO 9965 without the additional cache but with the same 16-core configuration and boost frequencies up to 5.5 GHz. In this case, the L3 cache drops to 64 MB. Lower in the lineup are the Ryzen 9 PRO 9955 and 9945, both with 12 cores and 24 threads. The former operates with a TDP of 120W, while the latter maintains the 65W power profile.

The other new model with X3D technology is the Ryzen 7 PRO 9755X3D, an 8-core and 16-thread solution with frequencies up to 5.2 GHz and a TDP of 120W. Thanks to the 3D cache, the processor reaches a total of 96 MB of L3 cache. AMD also offers the Ryzen 7 PRO 9755 without additional cache, but maintaining the same number of cores.

The lineup is completed by the Ryzen 5 PRO 9655, a model with 6 cores and 12 threads with boost up to 5.4 GHz and a TDP of 120W. Alongside it, the Ryzen 5 PRO 9645 at 65W remains available. In several cases, AMD has introduced versions with a higher TDP than existing models, increasing the operating margin for sustained frequencies under intensive multi-thread workloads.

According to AMD, the introduction of 3D V-Cache in the PRO lineup will accelerate data access and improve performance in complex professional workloads such as simulations, rendering, and real-time visualization. The increase in TDP should also ensure higher clock speeds even under prolonged load on all cores.

As is traditionally the case for the Ryzen PRO family, these processors will not be distributed through regular retail channels but will be integrated directly into OEM systems destined for the professional market. Lenovo has already confirmed the use of the new CPUs in the upcoming ThinkStation P4 expected in the third quarter of 2026.