PlayStation: Goodbye to Liquid Metal? Sony Patents Completely New Heat Sink

Sony is already looking towards the next generation of consoles and, through a new patent, we get a first glimpse of the possible evolution of the cooling system for the PS6. The document outlines a solution developed to maintain high thermal performance whether the console is positioned horizontally or vertically, one of the most controversial aspects of the PS5 that encountered various issues – and criticisms – due to liquid metal leaking out of place.

The documentation, simply titled "Electronic Device", actually also shows the design of a PlayStation 5 with an optical drive. The description features an architecture based on elongated heat pipes with progressively reduced sections and extensions dedicated to internal fluid management. The goal is to improve liquid circulation and the vaporization process, ensuring uniform heat dissipation regardless of the console's orientation.

According to the patent description, the extended portions of the heat pipes function as reservoirs. When the console is in a vertical position, these areas allow the fluid level in the sections dedicated to heat exchange to be lowered, promoting more efficient vaporization and preventing accumulations that might reduce the cooling system's performance.

Another interesting element pertains to the fluid used. The patent suggests the use of a standard sealed fluid, such as water, within the porous structure of the heat pipes. The heat produced by the processor would first be transferred to the heat pipes and subsequently to a series of finned blocks via a thermal transfer plate. Furthermore, the system is expected to completely exclude liquid metal as a heat transfer interface.

The project also pays attention to mechanical aspects. Sony indeed plans for extra space around the heat pipes to avoid pressures exerted by other internal components. This solution aims to keep the cooling system stable over time and reduce the risk of physical stress on the pipes.

In the patent, the company emphasizes the need to develop a cooling solution suitable for an electronic device usable in multiple positions. This contrasts with the PS5, which relies primarily on a large heat sink with copper heat pipes, liquid metal, and a ventilation system designed to channel airflow.

Should this technology be applied in the PS6, the new configuration would offer a very different approach compared to the current platform and could ensure consistent long-term performance, regardless of positioning and, importantly, also for extremely long gaming sessions.

As always, the filing of a patent does not necessarily represent technology on the way, but simply one of the paths explored by the company. The system will first be evaluated and, if costs, effectiveness, durability, or other aspects do not meet Sony's expectations, it will almost certainly not be applied.