Huawei Aims to Impress: The Next Kirin Chip Will Match TSMC's 3nm Chips

American sanctions have not stopped Huawei. The Chinese company continues to report excellent numbers, with smartphone sales growing and an increasingly significant presence across various market segments, as well as the ambition to become a benchmark in the computer segment.

Meanwhile, the Chinese company is also working on a new chip that could match the performance of solutions produced using TSMC's 3nm manufacturing process (used by current high-end Android and iPhone models).

The launch of this new Kirin chip is reportedly close. The project is very ambitious and reflects Huawei's desire to establish itself as the absolute market leader. It is worth noting that the latest models, such as the Kirin 9030, have not impressed in terms of performance.

An Ambitious Project

A new report claims that the next Kirin chip, which will be used in the Mate 90 series, aims to provide a substantial leap forward in performance, potentially matching chips produced with TSMC's 3nm process.

Unable to utilize EUV machinery for chip production, Huawei is reportedly focusing on a new technology called LogicFolding, to increase transistor density and enable the chip to achieve a high frequency (reportedly up to 5 GHz).

Currently, information available about the new chip is scarce. The new Mate 90 models are expected to debut between late 2026 and early 2027. Huawei's goal is clear: to achieve significantly superior performance compared to previous generations. We will have to wait a few months to see if this goal is met.