Intel to Produce Apple Chips M7 and A21 Using 18A-P and 14A Manufacturing Processes?

After rumors about the signing of a preliminary agreement between Apple and Intel for chip production, new leaks are emerging that lend more substance to the alleged understanding. According to information gathered by the financial research firm GF Securities and relayed by various industry sources, Cupertino is said to have already signed a preliminary agreement with Intel Foundry by the end of 2025 to produce part of the upcoming generations of SoCs using the 18A-P and 14A processes.

This agreement would represent a partial return to collaboration with Intel after abandoning x86 platforms in 2020 with the introduction of the first Apple Silicon chips (entirely manufactured by TSMC). The explosion in demand linked to artificial intelligence is saturating much of TSMC's advanced production lines, which is simultaneously trying to meet the requests of companies like NVIDIA, AMD, Qualcomm, and Apple itself. This has caused difficulties in ensuring adequate volumes and inflated production costs.

Intel therefore represents a possible alternative for Apple, as well as for other potential clients, to diversify the supply chain and secure additional production capacity in the United States, where Donald Trump's administration is strongly pushing for a return to domestic semiconductor production.

According to GF Securities, the first chip involved in the collaboration would be the Apple M7, intended for entry-level MacBook Air and MacBook Pro models. The SoC is expected to be produced using the Intel 18A-P process and enter mass production by the end of 2027. The 18A-P process represents an evolved version of the standard 18A designed to offer a better trade-off between power consumption and efficiency. Estimates suggest a performance increase of 9% at the same power consumption or an 18% reduction in power consumption while maintaining the same performance level. For Apple, traditionally focused on the energy efficiency of its laptops, these features would be particularly interesting.

For iPhones, Apple is reportedly considering the Intel 14A process for the future SoC A21, expected around 2028. In this case, Intel promises another generational leap in terms of transistor density, operating frequencies, and energy efficiency. There are also talks about the introduction of PowerDirect, an extension of the PowerVia power system introduced with the 18A process.

It is still unclear whether Apple intends to fully entrust Intel with the production of the A21 family or limit itself to standard versions while perhaps keeping the Pro variants at TSMC. Rumors suggest a strategy of gradual production diversification rather than a complete abandonment of the Taiwanese partner.

Intel might also provide its advanced packaging solutions to meet the performance needs of future Apple chips. Among the options mentioned are several variations of Foveros technology, including Foveros Direct and Foveros-S, along with EMIB solutions for high-bandwidth interconnection between chiplets. These technologies allow for 3D stacking and high-density connections through copper-copper links, increasingly relevant aspects in next-generation processors.

For Intel, a potential agreement with Apple would represent an important showcase for its manufacturing business, still striving to gain credibility in the contract semiconductor market. Securing a client the size of Apple could indeed bolster the confidence of other potential industrial partners in the American company's manufacturing capabilities.

For Apple, on the other hand, Intel could be a lifeline in case of worsening issues related to TSMC, not only of a production nature but especially geopolitical, with China intending to exert control over Taiwan in the near future.