Intel Core Ultra 400 'Nova Lake-S': up to 52 cores and 288 MB of cache in new desktop CPUs
The latest rumors about the upcoming Intel CPUs for desktop systems, code-named Nova Lake-S, outline a complex strategy based on five different package configurations. Starting with entry-level solutions based on a single die with 4 P-cores (Coyote Cove) and no E-cores, it extends to extremely advanced dual-die configurations.
The most advanced variants combine blocks of 8 P-cores and 16 E-cores, complemented by a large additional cache (bLLC), which according to rumors could reach 288 MB in the high-end models. The top-of-the-line model would therefore reach a total of 52 cores, confirming earlier forecasts from recent months.
A common feature across the entire range is the presence of 4 Low Power Efficiency (LPE) cores, dedicated to ultra-low consumption workloads, alongside a sixth-generation NPU for AI acceleration. Beyond the core count, Intel seems to want to standardize many key features across the entire lineup. All Nova Lake-S models are expected to offer:
- 24 PCIe 5.0 lanes directly from the CPU
- 2 Thunderbolt 5 ports
- Dual-channel DDR5 memory support up to 8000 MT/s
- Integrated graphics with 2 Xe3 cores (except for F variants without GPU)
At the platform level, advanced features such as support for Wi-Fi 7, Low Energy Audio, and Wi-Fi sensing will also emerge, alongside compatibility with ECC memory and new formats like CUDIMM and CSODIMM.
| Die Type | CPU Configuration | Hub / LP E-Core | NPU | Memory | PCIe | Thunderbolt | GPU |
|---|---|---|---|---|---|---|---|
| 8C | Single Die | 4P+0E | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 |
| 16C | Single Die | 4P+8E | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 |
| 28C | Single Die | 8P+16E | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 |
| 28C | DS | 8P+16E + cache | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 |
| 52C | DS | 8P+16E + cache + 8P+16E + cache | HUB, 4 LPE | NPU6 | 2 ch DDR | 24 PCIe Gen5 | 2 TBT5 |
On the storage and connectivity front, the platform is expected to handle up to eight SSDs between PCIe 5.0 and 4.0, in addition to flexible configurations of PCIe lanes (bifurcation 4x4). The internal segmentation appears particularly intricate. Rumors suggest at least 13 SKUs, divided among Core Ultra 9, Core Ultra 7, Core Ultra 5, and Core Ultra 3.
The CPUs will cover various power classes: 35, 65, 125, and up to 175W for the flagship models. The 175W versions, with 52 and 44 cores, might represent a new interpretation of the HEDT segment, although the commercial naming is not yet confirmed.
Nova Lake-S will introduce the LGA 1954 socket alongside 900-series chipsets (like Z990). However, Intel is expected to allow the reuse of existing cooling systems, suggesting some continuity with the current ecosystem. The rumor does not confirm the dual-lever retention mechanism that has been discussed in recent hours, nor does it guarantee the exclusivity of the more powerful CPUs to certain high-end motherboards.
| Brand | Total Cores | Core Configuration (P+E+LP) | Code | Notes | TDP/cTDP |
|---|---|---|---|---|---|
| Brand TBD | 52C | (8+16)+(8+16)+4 | P3DX | Dual 8+16 CDIE DS Die Package | 175W |
| Brand TBD | 44C | (8+12)+(8+12)+4 | P2DX | Dual 8+16 CDIE DS Die Package | 175W |
| Core Ultra 9 | 28C | 8+16+4 | P2D | 8+16 CDIE DS Die Package | 125W |
| Core Ultra 9 | 28C | 8+16+4 | P2K | 8+16 CDIE Die Package | 125W/65W |
| Core Ultra 9 | 22C | 6+12+4 | P2 | 8+16 CDIE DS Die Package | 65W |
| Core Ultra 7 | 24C | 8+12+4 | P1D | 8+16 CDIE DS Die Package | 125W |
| Core Ultra 7 | 24C | 8+12+4 | P1K | 8+16 CDIE Die Package | 125W/65W |
| Core Ultra 7 | 16C | 4+8+4 | P1 | 4+8 CDIE Die Package | 65W/35W |
| Core Ultra 5 | 22C | 6+12+4 | MS2K / MS2KF | 8+16 CDIE Die Package, has GT0 variant (F SKU) | 125W/65W |
| Core Ultra 5 | 12C | 4+4+4 | MS2 | 4+8 CDIE Die Package | 65W/35W |
| Core Ultra 5 | 8C | 4+0+4 | MS1 | 4+0 CDIE Die Package | 65W/35W |
| Core Ultra 3 | 6C | 2+0+4 | T1 | 4+0 CDIE Die Package | 65W/35W |
A significant point is the indication of future socket compatibility, implying support for multiple generations of CPUs, an aspect not always guaranteed in previous Intel platforms. An Intel representative had made statements regarding this a few weeks ago.
Mass production of Nova Lake CPUs is expected in the fourth quarter. It remains to be clarified whether the commercial debut will occur by the end of the same year or be pushed to the early months of 2027 as previously rumored.