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TechnologyApr 12, 2026· 3 min read

The marks on the thermal shield of Orion from the Artemis II mission seen during reentry are not concerning

In the night between Friday and Saturday (Italian time), the Artemis II mission successfully concluded, having brought a human crew beyond Earth's orbit for the first time since the Apollo program. This paves the way for a new era of lunar exploration, with a landing planned for early 2028 (for the NASA-led program, while in 2029 for the Chinese-led one).

The Artemis II mission did not encounter any particular unforeseen events or truly concerning situations. Among the main issues reported was a problem with the onboard toilet (which functioned for only a short time overall), some communication problems between the crew and mission control, as well as other issues related to onboard devices (such as cameras and action cams).

During the final phase of reentry, when the Orion Integrity capsule was about to touch the surface of the Pacific Ocean off the California coast, a light spot was noticed on the lower thermal shield. This "mark" raised questions about whether it indicated damage that, while allowing the mission to conclude successfully, could pose a risk to the crew.

Artemis II: The Mark on the Thermal Shield of Orion Integrity

After the first photographs appeared online, the more curious individuals tried to determine whether it was actually a problem or some other reason, also considering past issues with the thermal shield observed after the reentry of Artemis I (a crewless mission), particularly regarding an abnormal consumption of AVCOAT. NASA, as seen in the past, is expected to release a comprehensive report in the coming months when all components, including the vehicle itself, are analyzed.

A preliminary piece of information, however, comes directly from Jared Isaacman (NASA administrator), who responded to this question on X and wrote, "I am reluctant to precede an adequate review of the data, but I understand the curiosity of the space community, especially when images may give the impression of a problem. As one would expect, engineers were eager to inspect the thermal shield, starting with underwater images shortly after splashdown and continuing with an onboard review. No unexpected conditions were observed. I suspect that when the images are released, the significant difference in the performance of the thermal shields of Artemis I and Artemis II will be quite obvious. Regarding the specific question, the discoloration was not released material. The observed white color corresponds to the area of the compression pad and is consistent with the local geometry, AVCOAT by-products, and transitional heating environments. We have observed this behavior in arc jet tests and expected it in this area of the compression pad. We will complete a review of the data on all systems, including the thermal protection system, and make the public results available."

Isaacman's response also seems consistent with the early (partial) analyses regarding the position and observations in the OIG report from a few months ago. When someone pointed out to Isaacman that "not to be difficult, but... that's exactly what we heard after Artemis I. Until we saw the photos in the OIG report," the top executive wrote, "things have changed."

In general, it should be noted that the Orion capsule is launched with the thermal shield protected in the lower area by the service module (ESM). To anchor these two units, which separate shortly before the reentry of the command module, explosive bolts are used, and there are also compression pads that prevent damage during launch and trajectory correction, preserving the thermal shield as best as possible. When the service module separates, some of the bolts on the capsule in the thermal shield area are exposed to reentry heat and may release material. Without clearer and more precise photographs, it is difficult to get a clear idea of the thermal shield's condition after reentry, but these, as mentioned, will likely be released in the coming months.